12/28/2022 0 Comments Pcb reflow![]() ![]() Thinner boards will be more susceptible to warpage during reflow soldering if it’s less than the standard PCB thickness and you put yourself at risk of warpage. There are some basic steps designers can take with double-sided boards to prevent these defects: Opt for a Thicker Substrate with Symmetric Stackup Applying the process to a double-sided board does not necessarily require special equipment, but running the process twice puts the PCBA at risk of experiencing defects. The principal defect is warpage, while the secondary defect is a weak or failed solder joint. The trick here is to solder at just the right temperature and time as the components on the first side will be going through reflow soldering twice.ĭuring this process, some defects can occur on double-sided PCBs. In the double-sided PCB soldering process, components are placed and soldered on each side of the board individually. Reflow soldering will be used on high volume runs/low-cost prototyping runs, so designers should plan for reflow soldering during assembly. The Double-Sided PCB Soldering Processįor double-sided PCBs with SMD components, the board will need to go through sequential reflow soldering unless you opt for hand assembly. Here’s what you can do to ensure high yield after double-sided PCB soldering. Like other manufacturing defects, there are some steps a designer can take to ensure their double-sided PCBA will have high yield. Double-sided PCBs, where components are placed on both sides, carry some important assembly guidelines to prevent warpage and low solder strength. DFM guidelines tend to focus on fabrication, but PCB assembly should also be considered in the design to ensure a board can be fabricated without defects. ![]()
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